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ARBOR WAFERING BLADE, Each

705.28

Details

1/2 in. (12.7mm) Arbor Wafering Blades, Dia:4 in. (102mm), Thick:0.012 in. (0.3mm),Series 15 Low Concentration Diamond, use with hard brittle materials, structural ceramics, glass, electronic substrates, alumina, zirconia, concrete

Additional Information

SKU 1826969
UOM Each
UNSPSC 27111500
Manufacturer Part Number 114254